Custom ALD Coatings for Complex Parts & Demanding Applications

Atomic Layer Deposition (ALD) is a thin-film coating technique that deposits materials one atomic layer at a time using sequential, self-limiting chemical reactions. Because each reaction stops once the exposed surface is used up, film thickness is set by the number of cycles, giving angstrom-level control. ALD matters for modern devices because, with enough precursor exposure and purge time, it can coat trenches, pores, and internal features that line-of-sight methods miss, and it can build nanolaminates and multilayer stacks with very precise layer thicknesses.

We can coat a wide variety of parts including metals, polymers, porous materials, 2D and 3D structures, and small parts. Many 3D printed parts can also be ALD coated. Our 3D-capable chambers are designed for complex geometries, high-aspect-ratio structures, internal features, and porous foams, and we review rough surfaces, trapped powder, and the print material's temperature limit before coating. Unlike providers optimized for wafers or flat coupons, we focus on parts that aren't flat.

Turnaround times vary depending on project complexity, material requirements, and current workload. Standard projects typically take 2-4 weeks from sample receipt to delivery, with rush services available for urgent projects. Pricing depends on substrate type, coating material, thickness requirements, and quantity. We provide detailed timelines and competitive pricing during the quotation process, with transparent communication throughout the project.

We provide detailed shipping instructions and can work with you to ensure proper packaging and handling of your parts. Many substrates are ALD-compatible, including metals, ceramics, glass, silicon, polymers, and composites. Compatibility depends mainly on the substrate's temperature tolerance, outgassing under vacuum, and surface chemistry. Our materials-agnostic approach means we can develop custom processes for challenging materials, thermal limitations, or complex geometries. We'll evaluate your specific substrate and requirements during the initial consultation.

On complex parts, ALD's main advantage is conformality. PVD is limited by line of sight, while ALD precursors react with every surface they reach, so ALD can coat trenches, bores, and internal features. Uniform coverage in deep or narrow features depends on giving each precursor enough exposure and purge time, which we set for the specific geometry. Compared to CVD, ALD offers finer thickness control, and many ALD processes run at lower temperatures, which suits delicate substrates. The trade-off is speed: ALD deposits slowly, so PVD or CVD is often the better choice for thick films on simple parts. Our plasma-free processes suit polymers and organics that plasma exposure could damage.

We're not just a lab or vendor—we're a technical partner. Unlike firms focused on standardized services, we're materials-agnostic and chemistry-capable, developing custom processes for your specific needs. We focus on complex geometries and delicate substrates where standard processes fall short. As a nimble company, we offer faster response times, transparent communication, and engineering-level access throughout your project. We're trusted by NASA, Medtronic, Raytheon, and the US Army.